First BASF filament developed on Ultramid®

Ultrafuse® PA is specially developed for FFF printing based on BASF's polyamide portfolio known as Ultramid®. With its unique mechanical properties due to its chemical structure it is suitable for wide range applications working in broader temperature range.

BASF‘s Ultramid® grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6/66. Ultramid® is noted for its high mechanical strength, stiffness and thermal stability. In addition, Ultramid® offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.

Ultrafuse® PA is the translation of BASF's Ultramid® to 3D printing space. It is based on copolyamide 6/66 grade of intermediate viscosity. With Ultrafuse® PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special fi laments can be created.

Advantages of Ultrafuse® PA

• Good fatigue resistance
• Low melting point makes it printable for many FFF printers
• Good wear resistance/lubricity